Technical core and performance indicators
The device adopts an embedded pressure sensor with an accuracy level of 0.1, which can capture 0.1N-level pressure fluctuations, which is suitable for precision component detection. For example, in the chip packaging test, the sensor can accurately record the pressure increment during the pressing process and generate a smooth pressure-deformation curve with a deviation rate of less than 2%. The test platform is usually treated with No. 45 steel tempering, and the surface roughness is Ra≤0.8μm to ensure that the small components are evenly subjected to force. Some models are equipped with a dual-station independent test system, which supports multi-segment curve pressure control and meets ISO 3035, GB/T 4546-2008 and other industry standards.
Functional characteristics and operational advantages
The device integrates the microcomputer control system and supports manual/automatic dual-mode loading. In automatic mode, you can preset the pressure value (such as 2kN/min loading speed) and pressure retention time, display the pressure curve in real time and generate Excel format reports. Its overload protection function can automatically stop when the pressure exceeds the range by 110% to avoid sensor damage.
